Intertechnik LP/Base/Copper base material Epoxy FR4 | 365 x 267 mm

Highlights

• Excellent electrical insulation properties
• Great mechanical strength
• Perfect compatibility with standard PCB manufacturing processes

Product details

Base material for PCB construction with a base layer of Epoxy FR4 substrate, on which a layer of copper is deposited or laminated to create the conductive traces and pads. This layered structure is typical in many standard PCB designs and is essential for the functioning of electronic circuits in various devices.

Laminated to create the conductive traces and pads. This layered structure is typical in many standard PCB designs and is essential for the functioning of electronic circuits in various devices.